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Preliminary
MT9D131: 1/3.2-Inch 2-Mp SOC Digital Image Sensor
Package Dimensions
Package Dimensions
Figure 8:
Seating
plane
D
A
48-Pin CLCC Package Outline
1.7
2.3 ±0.2
Substrate material: alumina ceramic 0.7 thickness
Wall material: alumina ceramic
Lid material: borosilicate glass 0.55 thickness
47X
1.02 ±0.20
48X
11.22
1.02
TYP 48 1
48X R0.19
2.16 ±0.20
H CTR
?0.20 A B C
First
clear
pixel
0.51 ±0.05
6.03 6.6
11.22
5.61
7.11
14.22
V CTR
?0.20 A B C
13.6 ±0.1
CTR
1.02 TYP
Image
sensor die:
Optical area
4X
0.2
5.61
6.6
14.22
7.11
B
C
A
0.05
0.675 thickness
13.6 ±0.1
CTR
Maximum rotation of optical area
0.10 A
relative to package edges: 1o
Optical
center 1
Lead finish:
Au plating, 0.50 microns
minimum thickness
over Ni plating, 1.27 microns
minimum thickness
1.400 ±0.125
0.90
for reference only
0.35
for reference only
Maximum tilt of optical area
relative to seating plane A : 50 microns
relative to top of cover glass D : 100 microns
Note: 1. Optical center = package center.
?
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
Micron, the M logo, the Micron logo, and DigitalClarity are trademarks of Micron Technology, Inc. All other trademarks are
the property of their respective owners. Preliminary: This data sheet contains initial characterization limits that are subject
to change upon full characterization of production devices.
PDF: 09005aef824c90ce/Source: 09005aef824c90d6
MT9D131_LDS_2.fm - Rev. B 3/07 EN
17
Micron Technology, Inc., reserves the right to change products or specifications without notice.
?2006 Micron Technology, Inc. All rights reserved.
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